简要叙述了自悬浮定向流方法制备铜纳米粉末的原理和包覆层薄膜的生长机理,采用空心阴极辉光放电对铜纳米粉末进行有机包覆,实验中CH₄和H₂的流量分别为6 ml/min和12 ml/min,工作电压为450 V,衬底与空心阴极的底端距离为2 cm,背景真空和工作气压分别为6 Pa和100 Pa,沉积速率为7.5 nm/min.用透射电镜(TEM)对铜纳米粉末进行了观察和分析,结果表明:铜纳米粉末呈球状,其粒径分布在10～100 nm之间, 平均粒径大小为50 nm;其包覆层的厚度大约为15 nm,而且该厚度可以通过调节空心阴极辉光放电的参数来控制.

Copper nanoparticles were synthesized by the flow-levitation method and they were coated with the carbon-and-hydrogen films through the hollow-cathode glow discharge(HCGD). The growth mechanism of the coating films was described. The HCGD with a voltage of 450 V was used for producing CH plasma. The input fluxes of H₂ and CH₄ were 12 ml/min and 6 ml/min, respectively. The distance from the sample step to the bottom of the cathode was 2 cm. The working pressure was 100 Pa and the deposition velocity was 7.5 nm/min. The coated Cu nanoparticles and uncoated ones were observed with transmission electron microscopy. Cu nanoparticles were spherical but not very well defined, and the particle size ranged from 10 nm to 100 nm in diameter. The coating thickness was about 15 nm for most of the nanoparticles.