强激光与粒子束, 2004, 16 (6): 681, 网络出版: 2006-05-15
用电子散斑干涉法测量材料热膨胀系数
Application of electronic speckle pattern interferometry in thermal expansion coefficient measurements
热膨胀系数 电子散斑干涉法 温升率 Thermal expansion coefficient Electronic speckle pattern interferometry（ESPI） Temperature-rising ratio
摘要
利用双光束电子散斑干涉法(ESPI)对试件受热变形进行了实时观测,针对一次实验过程中得到的图片较多(300～500幅)的特点,在图像处理时摒弃了以往的手动识别等位移线的办法,用MATLAB语言编写了批处理程序,能够在采集的大量散斑图片中自动快速准确地标定等位移线.得到相应的位移和应变.并结合实时测量的温度值,获得了45钢和LY12铝合金在不同温升率下的热膨胀系数及其随温度的变化.实验结果表明,在涉及的温升率范围内,温升率的改变对材料热膨胀系数的影响不明显.材料的热膨胀系数随温度的升高略有上升.
Abstract
In this paper,the thermal expansion coefficients of LY12 and 45 steel in different temperature-rising ratio are acquired by electronic speckle pattern interferometer(ESPI).for the pictures (300～500 frames) of each experiment,a batch processing code was designed to identify the central lines automatically instead of the old manual recognition. After displacements and real-time temperature measurements obtained,the thermal expansion coefficients can be deduced. It is proved that in the temperature-rising-ratio range concerned in this paper,the thermal expansion coefficients are almost independence of temperature-sising ratio and at the same time,they increase within a narrow range when the temperature rises.
陈思颖, 黄晨光, 陈捷, 王春奎, 段祝平. 用电子散斑干涉法测量材料热膨胀系数[J]. 强激光与粒子束, 2004, 16(6): 681. CHEN Si-ying, HUANG Chen-guang, CHEN Jie, WANG Chun-kui, DUAN Zhu-ping. Application of electronic speckle pattern interferometry in thermal expansion coefficient measurements[J]. High Power Laser and Particle Beams, 2004, 16(6): 681.
PDF全文
