系统阐述了金属键合的发展概况、基本工艺和方法、表征技术及其在光电器件中的应用。金属键合制备光电器件的一般工艺流程分为三步：蒸镀金属薄膜、键合、腐蚀去除衬底，列举了常用的金属键合方法及其工艺条件;并着重论述了该技术在光电器件特别是垂直腔面发射激光器(VCSEL)器件结构制作中的应用。金属键合可以实现衬底倒扣和改善器件热学性能，而对器件原有的光学性质影响不大。

The metallic bonding technique is summarized generally, including its developing status, fundamental process and methods, characterization and application to the optoelectronic devices. The common process of the metallic bonding is expatiated, and it can be divided into three steps: evaporation of metals, bonding and substrate etching. The common methods of metallic bonding and its processing condition are also summed up. Especially, The application in the structure fabrication of optoelectronic devices, such as vertical cavity surface emitting laser(VCSEL) is discussed. Metallic bonding can realize up-down assembly and improve the thermal property. But it has little influence on the original optical property of the device.