针对量子阱半导体激光器建立了内部的热源分布模型,利用有限元方法模拟计算得到了条形量子阱半导体激光器的三维稳态温度分布,分析了芯片与热沉间的焊料空隙对芯片内部稳态温度分布的影响。模拟结果表明焊料空隙的位置和尺寸都将影响到芯片内部的温度分布,焊料空隙的存在将导致空隙上方的芯片内部出现局部热点。随着焊料空隙的增大,芯片内热点区域增大,温度增高。位于芯片的条形电极中心下方的焊料空隙引起的芯片内部局部温升最大,并且沿腔长方向光出射腔面上温度相对较高,易引起光出射腔面上正反馈的电热烧毁,与实验结果吻合。

A model of internal heat source distribution is presented for quantum-well laser. Three-dimensional temperature distribution of the stripe quantum-well laser is simulated by using the finite element method, and the influence of solder voids between chip and heat sink on the steady-state temperature distribution is discussed. It is found that the chip′s internal temperature distribution is influenced by the position and size of solder voids. The localized hot spot may result from the nether solder voids, and the strong localized temperature rises and the hot spot expands with the expanding of the void′s dimension. Simulated result shows further that the strongest temperature rise is caused by solder voids under the center of the electrode stripe, and moreover, the highest temperature lies at the front facet. So catastrophic optical damage (COD)will be found at the front facet most possibly, which is in agreement with the test.