激光与光电子学进展, 2009, 46 (9): 35, 网络出版: 2009-10-09
功率型白光LED封装设计的研究进展
Development of Packaging Design of High-Power White LED
大功率白光LED 荧光粉 灌封胶 封装材料 封装结构 high-power white LED phosphor pouring sealant package material package structure
摘要
综述了功率型白光LED封装的研究现状和存在的问题，着重从LED封装结构和封装材料两个方面进行了详细的评述。在现有蓝光芯片激发钇铝石榴石（YAG）荧光粉来实现节能、高效的白光LED照明的基础上，介绍了可以提高功率型白光LED的取光效率和空间色度的均匀性的各种封装结构和材料。指出新的封装结构、封装材料和封装工艺的有机结合以获得高取光效率，延长功率型白光LED的使用寿命，节约整体封装结构的成本，从而推进LED固体光源的应用是今后功率型白光LED研究的重点。
Abstract
The status and problems of high-power white LED are reviewed and the structures and materials of packaging are discussed in detail. Base on the YAG phosphor excitated by the blue chip, the new structures and materials of packaging to extract more light and realize the uniformity of chromaticity are introduced. It is pointed out that the appropriate combination of the innovative structures, the materials, and the technologies of packaging is the development focus point of the high-power white LED in future.
李柏承, 张大伟, 黄元申, 倪争技, 庄松林. 功率型白光LED封装设计的研究进展[J]. 激光与光电子学进展, 2009, 46(9): 35. Li Baicheng, Zhang Dawei, Huang Yuanshen, Ni Zhengji, Zhuang Songlin. Development of Packaging Design of High-Power White LED[J]. Laser & Optoelectronics Progress, 2009, 46(9): 35.
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