二极管激光线阵封装中产生的“smile”现象对激光器的激射特性、寿命、光束质量等都会产生较大的影响。采用高分辨率CCD、快轴准直透镜及柱面透镜组成的单轴放大系统对激光线阵发光单元成像及基于光斑强度求质心的算法实现了二极管激光线阵“smile”的测量。实验结果表明:在阈值电流附近,采用In焊料焊接的器件“smile”小于2 μm,讨论了快轴准直透镜、CCD等对实验结果的影响。

Diode laser array curvature “smile” produced in the packaging process affects the lasering characteristics,life and beam quality of lasers. Using uniaxial amplification system composed of a high-resolution CCD,a fast axis collimation lens and cylindrical lenses,via laser emitters imaging and facula intensity-based centroid algorithm,the “smile” of diode laser array is measured. The experimental results show that:in the vicinity of threshold current,“smile” of the diode laser array with In solder is less than 2 μm. Influences of FAC lens and CCD resolution on the results are analyzed.