现代显示, 2009, 20 (10): 59, 网络出版: 2010-05-29
中国LED封装技术与国外的差异
LED Encapsulation Technology Discrepancy between Abroad and China
摘要
本文从封装设备、LED芯片、辅助封装材料、封装设计、封装工艺、LED 器件性能等方面描述了当今中国LED 封装技术与国外技术的差异，既肯定了中国LED 封装技术长足的进步，也找出了与国外技术之间的差距。
Abstract
This article describes the technology difference between China and other countries from LED packaging equipment，LED chip，LED packaging material，LED packaging design，LED packaging technics，LED component characteristic． It shows that the LED packaging technology in China has greatly improved and there are also some gaps in some areas com pared w ith overseas advanced technology．
李漫铁. 中国LED封装技术与国外的差异[J]. 现代显示, 2009, 20(10): 59. LI Man-tie. LED Encapsulation Technology Discrepancy between Abroad and China[J]. ADVANCED DISPLAY, 2009, 20(10): 59.
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