为了减小半导体激光器列阵在封装过程中引入热应力而产生的smile效应，提高半导体激光器列阵光束质量，利用对半导体激光器列阵发光点成像放大的方法，准确测量了半导体激光器列阵的smile效应，测量误差为±0.1 μm。由于smile效应的准确测量能客观地比较减小smile效应的各种技术与方法，本文根据分析测量结果，提出了通过优化封装半导体激光器列阵焊接回流曲线的方法，使smile效应值控制在±0.5 μm内。该方法减小了半导体激光器列阵的smile效应值，提高了激光器列阵光束质量，为下一步研制小芯径、高光束质量半导体激光器列阵光纤耦合模块提供了基础条件。

To reduce the smile effect caused by the thermal stress and to improve the beam quality of laser diode arrays, a set of optical system is designed for measuring the smile effect.By using an image amplification method, the smile effect of a laser diode array is accurately measured, and the measurement error is about ±0.1 μm.The quantitative characterization of the smile effect is a key technology to compare objectively the different measuring methods for smile effect and to reduce or eliminate the smile effect.According to analysis of the measurement results,the diode laser array package technique about reflow soldering is optimized, and the smile effect has been controlled within ±0.5 μm.As the smile effect values of the laser diode array is decreased and the beam quality of the laser diode array is improved significantly,the proposed method provides a technological fundation for development of small fiber diameters and high beam quality diode lasers.