针对高功率全固态激光器抽运源的需求, 开展了808 nm连续1500 W阵列激光器封装技术研究。理论上从封装应力、封装热阻和光束整形等三方面分析了大功率激光器封装的要求。解释了封装应力来源、表现和缓解途径; 模拟了微通道热沉结构的封装散热效果云图; 指出了光束整形的必要性以及与封装残余应力的关系。技术上通过研制铟/金复合焊料体系, 配合控制烧焊曲线和烧焊过程, 得到了良好的烧焊效果; 结合设计使用高精度光束整形装配夹具, 实现阵列平均“smile”值2 μm, 发散角6 mrad的实验效果。

To meet the requirements of high power laser diode-pumped solid-state lasers, packaging of 808 nm 1500 W continuous wave (CW) operation perpendicularity laser diode stack is reported. Theoretically, the influences of packaging-induced stress, thermal resistance, and beam collimation on high power laser diode stack fabrication are explained detailedly. The origination, exhibition and reduction approach of the residual stress are illuminated. Simulation of temperature distribution of the micro-channel heat sink is depicted. Necessity of the beam collimation and the relation between soldering process and focusing optics system are illustrated. The residual stress is reduced by investigating and using indium-gold composite solder and optimizing the parameters of the soldering process, and the alignment precision is improved by designing collimation tools that a average value of 2 μm for the smile and 6 mrad for the divergence angle could be realized.