为了实现石英玻璃基板的高效、高质量加工，进一步改善光掩模设备的性能，进行了石英玻璃化学机械磨削(CMG)加工技术的研究。通过在磨削过程中主动增强磨粒、结合剂以及磨削液与工件的化学反应，并使化学反应与机械去除作用形成动态平衡，从而消除因材料脆性去除而造成的表面损伤等，实现了大口径玻璃工件的高表面质量、高形状精度的加工。针对石英玻璃CMG加工的特点，开发了CMG专用砂轮及磨削液，利用正交实验法优化了石英玻璃CMG加工工艺参数，分析了CMG加工过程中磨削压力、砂轮转速、磨削液流量、pH值等因素对加工表面粗糙度及加工效率的影响，并利用优化后的工艺参数加工得到了Ra为0.795 nm的石英玻璃表面。加工后基板的光学性能和化学机械抛光(CMP)加工基板的光学性能相同，能够满足光掩模设备的性能需求。

To achieve a high-quality quartz glass substrate and to improve the performance of photomask equipment, a Chemical Mechanical Grinding (CMG) method for the quartz glass is developed. By actively enhancing the chemical reactions of the workpiece and the abrasive grain, bond and the grinding fluid and dynamically balancing the chemical reaction and mechanical remove,the process method can avoid the sub-surface damage caused by eliminating the brittle material to achieve high surface quality and high shape precision processing of a large-diameter glass workpiece. For the processing characteristics of CMG for the quartz glass, this paper develops the CMG-specific wheel and grinding fluid. Then it uses orthogonal experiment method to optimize the CMG process parameters for the quartz glass, and analyzes the effects of the grinding pressure, wheel speed, grinding fluid traffic, pH value and other factors on the surface roughness and processing efficiency in CMG processing.On the basis of the optimized processing parameters, it obtains the surface roughness of quartz glass in 0.795 nm. Obtained results show that the finished substrates have the same optical performance with the substrates processed by Chemical Mechanical Polishing(CMP), and the performance can meet the needs of photomask equipment.