光子学报, 2010, 39 (11): 2036, 网络出版: 2010-12-07
数字图像相关方法在板载芯片封装热变形测量中的应用
Application of Digital Image Correlation on Surface Deformation Measurement of Chip on Board Packaging Structure
测量 热变形 数字图像相关方法 板载芯片封装 微机电系统 Measurement Surface deformation Digital Image Correlation(DIC) Chip On Board(COB) packaging MicroElectroMechanical System(MEMS)
摘要
针对板载芯片封装结构中由于各层材料热膨胀系数的差异引起的热失配现象，利用数字图像相关方法对板载芯片封装结构在热载荷下的表面热变形分布进行实验测量，并比较了不同封装配置对结构热变形的影响.建立了适于求解结构表面热变形分布的理论模型，利用实验结果和有限元模拟验证了理论模型.同时表明了实验方法的有效性和可行性，为微机电系统器件设计提供了有益的参考.
Abstract
Aiming at the thermal mismatch caused by different Coefficients of Thermal Expansion (CTE) of each material in Chip on Board(COB), Digital Image Correlation (DIC) is used to measure the thermomechanical coupling effect in COB packaging structures, and effects of different type substrate are compared. The experiment results are compared with both the results of FEM simulations and the theoretical model. Experimental results reveal that DIC can successfully be applied to the analysis of the thermomechanical coupling effect and provide an availability consult to the design of MEMS apparatus.
陈凡秀, 何小元. 数字图像相关方法在板载芯片封装热变形测量中的应用[J]. 光子学报, 2010, 39(11): 2036. CHEN Fanxiu, HE Xiaoyuan. Application of Digital Image Correlation on Surface Deformation Measurement of Chip on Board Packaging Structure[J]. ACTA PHOTONICA SINICA, 2010, 39(11): 2036.
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