介绍了红外杜瓦组件的总体封装形式并回顾了国内外的发展情况，对7通道长波光导线列器件在杜瓦瓶中的基板封装形式进行了研究，提出了三种基于厚膜工艺和薄膜工艺的陶瓷基板封装形式.其中，第一种“直接引线式封装”体积过大，第二种“陶瓷针型栅格阵列封装”形式缺少合适接插件，而第三种”分时分组封装”形式使用了薄膜和厚膜基板相键合分时读出的方式，不仅很好地解决了布线问题，而且能方便地使用柔性电缆将信号引出，系统性能要求得到满足.

An optimum packaging structure of photoconductive infrared detector which is a 7-channel device and made in the form of linear array was proposed. After a brief introduction to the basic elements in dewar assembly, the development of dewar assembly at home and abroad was reviewed by examining the assembly design. Based on the review of previous work, the performances of three different designs were compared: the first design provided direct electronic feed-through and contacted points with a number of cables and wire feeds, yet fails to a significant increase in the size of the device; the second one adopted Ceramic Pin Grid Array as the package, however this design was unavailable due to the lack of the optimal contact points; the third design absorbed the idea of “time-sharing” with both thick film and thin film technology. Furthermore, the third one of an innovative cabling solution enabled the infrared detect or to offer high performance and good response speed by using flexible cables.