红外, 2011, 32 (1): 10, 网络出版: 2011-02-22
光电器件薄膜附着力评价方法的研究进展 下载: 543次
Recent Progress in Evaluation of Thin Film Adhesion in Optoelectronic Devices
摘要
薄膜与衬底的结合性能一直备受关注。在各种情况下,薄膜的性能 都依赖于其与衬底的附着力大小。为了提高附着强度,需要深刻理解附着力的机理和开发合适的附着力测试技术。从基准 附着力、热力学附着能和实际附着力三个不同角度提供了附着力评价途径。作为广泛使用的附着力粘接测试技术,拉脱法和压带剥落法等方法在大量 样品测 试方面具有独特优势,可定性、半定量地评价薄膜附着 性能。
Abstract
The characteristics of the adhesion between a thin film and its substrate have been being much concerned. The performance of the thin film depends on the adhesion between the film and its substrate in all cases. To enhance the adhesion, the adhesion mechanism should be understood fully and the appropriate technology for measuring adhesion is required. The adhesion is evaluated in terms of basic adhesion, thermodynamic adhesion energy and actual adhesion. As the widely used adhesion test technologies, the pull-off test and peel test methods show their unique superiority in dealing with a large number of samples and can be used to evaluate the adhesion performance of thin films qualitatively and semi-quantitatively.
钱大憨, 贾嘉, 陈柳炼, 刘福浩, 刘飞, 张立瑶, 叶柏松, 李向阳. 光电器件薄膜附着力评价方法的研究进展[J]. 红外, 2011, 32(1): 10. QIAN Da-han, JIA Jia, CHEN Liu-lian, LIU Fu-hao, ZHANG Li-yao, LIU Fei, YE Bai-song, LI Xiang-yang. Recent Progress in Evaluation of Thin Film Adhesion in Optoelectronic Devices[J]. INFRARED, 2011, 32(1): 10.