随着高亮度白光LED在室内、室外照明领域的应用，多芯片LED的集成封装方式是其发展的主要趋势之一，而热问题却是多芯片LED集成封装的瓶颈问题之一。建立了多芯片LED集成封装的等效热路模型，并采用有限元分析(FEA)的方法对多芯片LED集成封装的稳态热场分布进行了分析，同时通过制作实际样品研究大功率LED多芯片集成封装的热阻、发光效率与芯片工作数量的关系。结果表明集成封装的多芯片白光LED结温随着集成芯片数量的增加成线性增长，芯片到基板底面的热阻随着芯片工作数量的增加而增大，而其发光效率随着集成芯片数量的增加成线性减小。

With the application of highbrightness LED in indoor and outdoor lighting, multichip package is one of the most promising development trends. However, the heat influence is still the bottleneck problem which restricts the development of multichip package. In this paper, combining the equivalent thermal resistance network model of multichip LED package, the steady state heat distribution of multichip LED package was simulated by using the finite element analysis (FEA) method. At the meantime, a multichip LED sample was designed and packaged. The results indicate that the junction temperature and the thermal resistance of the chip from PN junction to the board increase while the luminous efficiency decreases linearly with the number of working LED chips.