针对玻璃微流控芯片制作中普遍存在的成本高、加工周期长等问题，提出了一种基于湿法腐蚀技术的低成本、实用化制作方法。该方法以商用显微载玻片作为基底材料，采用普通负性光刻胶RFJ220为腐蚀掩模，通过优化光刻及湿法腐蚀工艺，可得到深度大于40μm(最深可达110μm)，侧向钻蚀比为1.25∶1，表面粗糙度小于5.2nm的微沟道。重点解决了光刻胶与基底之间的粘附性问题，并分析了腐蚀液的配比及腐蚀方式等对沟道形貌的影响。整个制作工艺过程简单，成本低，稳定性好，可广泛应用于玻璃微流控芯片的制作中。

Aiming at the problems such as high cost and long processing period in fabricating glassbased microfluidic chips, a simple and low cost fabrication process based on wet etching technology was proposed. Commercial glass slide was used as the substrate, and the general negative photoresist RFJ220 was used as the etching mask. By optimizing the processing parameters of photolithography and wet etching, microchannels with the depth greater than 40μm, undercut ratio of 1.25∶1 and surface roughness less than 5.2nm were obtained. The problem of adhesion between the photoresist and the substrate was solved. It was also analyzed the influence of corrosive liquid ratio and etching methods on the microchannel surface topography. The whole process is simple, low cost, reliable, and can be widely used in the fabrication of glass based microfluidic chip.