为了满足微成形技术产业化的需求,讨论了一种新的微成形方法——激光驱动飞片加载基体/金属薄膜层裂微成形技术，结合激光辐照效应及波的反射规律阐述了层裂微成形原理；优化了基体/金属薄膜层裂工艺，并且根据能量守恒原理，估算了层裂片的应变率和激光诱导冲击波的峰值压力。结果表明，随着脉冲能量的逐渐增大，工件层裂现象不断明显，直到金属薄膜上最后出现与模板微结构相同的特征结构，但基体始终保持完好，未出现裂纹或变形。通过激光驱动飞片加载基体/金属薄膜实现层裂微成形是可行的。

In order to meet the need of micro forming technology industrialization, a new method, micro-forming spallation delamination micro-forming of substrate/metal thin films under laser driven flyer, was discussed. Combining with laser radiation effect and wave reflection, spallation delamination micro-forming mechanism was expounded. The spallation process of substrate/ metal thin film was optimized and strain rate of layers lobes and peak pressure of laser-induced shock wave were estimated according to the principle of conservation of energy. It was found that the spallation of phenomenon of workpieces became apparent with increase of pulse energy, until metal thin films appeared the same structure characteristics as micro-structure of the template, but the substrate remained intact without cracks or deformation. It shows that it’s available to achieve spallation and micro-forming of substrate/thin film under laser driven flyer loading.