光电工程, 2012, 39 (6): 62, 网络出版: 2012-06-25
实测端元光谱和多光谱图像之间的模拟与细分
Simulation and Subsection between Fields Measured Endmember Spectrum and Multi-spectrum Image of TM
实测端元光谱 多光谱 尺度转换 光谱细分 图像模拟 field measured endmember spectrum multi-spectrum scale transformation subsection spectrum image simulation
摘要
地物光谱特性是遥感应用的基础。本文以渭干河-库车河三角洲绿洲为研究区,首先选取裸土、植被两类地物作为研究对象,通过 TM传感器的光谱响应函数,实现了将野外实测端元光谱拟合为多光谱离散光谱。其次在对 TM图像的光谱波段进行细分的基础上,利用光谱知识库的数据支持来模拟获取具有更高光谱分辨率的细分光谱光学遥感图像,深入开展两种尺度相互转换的研究。结果表明:一、拟和的多光谱与 TM像元光谱具有很好的相关性,在此基础上,采用线性算法建立端元光谱与遥感图像像元光谱的转换模型,实现了从实测端元光谱尺度向遥感多光谱像元尺度的定量光谱转换,为遥感定量分析奠定了一定基础。二、细分光谱模拟图像的方法能够较为可靠的模拟出真实高光谱分辨率图像的信息,模拟方法可信,达到了推广和验证的效果。
Abstract
The characteristic of ground-objects spectrum is the basis of application of remote sensing. The imaging simulation principles of the optics image were described and a method using field measured endmember spectrum with higher spectrum resolutions was proposed to simulate spectrum of multi-spectrum images with lower spectrum resolution. The authors take the delta oasis of Weigan and Kuqa rivers as a study area, and choose vegetation and soil as study object. Firstly, we accomplished the simulation from field measured endmember for multi-spectrum by using the spectral response function of TM, and found the large correlation between simulated multi-spectrum and pixel spectrum of TM by using the statistical analyze. The linear model is set up to accomplish the quantitative transformation from endmember scale to pixel scale. Secondly, the translation relationship between the data computed from RS images and the data measured directly from the earth surface were analyzed. A method was proposed by using images with lower spectrum resolution to simulate images with higher spectrum resolutions.
张飞, 塔西甫拉提·特依拜, 丁建丽, 买买提·沙吾提, 江红南, 韩桂红, 桂东伟. 实测端元光谱和多光谱图像之间的模拟与细分[J]. 光电工程, 2012, 39(6): 62. ZHANG Fei, TASHPOLAT·Tiyip, DING Jian-li, MAMAT·SAWUT, JIANG Hong-nan, HAN Gui-hong, GUI Dong-wei. Simulation and Subsection between Fields Measured Endmember Spectrum and Multi-spectrum Image of TM[J]. Opto-Electronic Engineering, 2012, 39(6): 62.