现代显示, 2012, 23 (7): 22, 网络出版: 2012-08-09
利用FLOTHERM对液晶模组背光模块的热分析
Thermal Analysis of LCD Backlight Module Using FLOTHERM
摘要
在阐述了液晶模组热设计重要性的同时,介绍了热分析的基本思想和传热学基本知识。并利用FLOTHERM软件对液晶模组的背光模块进行热分析,采用AL5052作为PCB基板,比较不同厚度PCB对背光模块散热性能的影响。
Abstract
This paper described the importance of thermal design for LCM and introduced the basic ideas of thermal analysis and basic knowledge of heat transfer. Then by using FLOTHERM software to analysis the LCM. At last, PCB with AL5052 of different thickness thermal performance of the LCD module is compared.
孙菠, 刘坤, 张宏伟, 古诗路, 刘福才, 张克然. 利用FLOTHERM对液晶模组背光模块的热分析[J]. 现代显示, 2012, 23(7): 22. SUN Bo, LIU Kun, ZHANG Hong-wei, GU Shi-lu, LIU Fu-cai, ZHANG Ke-ran. Thermal Analysis of LCD Backlight Module Using FLOTHERM[J]. ADVANCED DISPLAY, 2012, 23(7): 22.