红外技术, 2012, 34 (12): 699, 网络出版: 2012-12-31
制冷型红外焦平面探测器引线键合质量优化研究
Study on Optimum of Wire Bonding for the Cooled Infrared Focal Plane Detector
制冷型探测器 引线键合 键合优化 焦平面 可靠性 cooled infrared focal plane detector wire bonding optimization methodical control of quality reliability
摘要
介绍了制冷型红外焦平面探测器引线键合工艺，分析和总结了焦平面探测器引线键合的失效模式，对主要失效模式进行了优化研究和试验验证，提出了引线键合的质量控制方法，并给出了相应的测试结果，对提高焦平面探测器引线键合具有很好的指导意义。
Abstract
This paper describes the wire bonding technology for cooled infrared focal plane detector, analyzes and summarizes the infrared detector wire bonding failure mode. The study on optimum, experiment testing, methodical control of quality and testing results are presented for the main wire bonding failure mode, which will be guidance for the improvement of reliability of infrared detector wire bonding.
田立萍, 朱颖峰, 王微, 徐世春, 董黎, 熊雄. 制冷型红外焦平面探测器引线键合质量优化研究[J]. 红外技术, 2012, 34(12): 699. TIAN Li-ping, ZHU Ying-feng, WANG Wei, XU Shi-chun, DONG Li, XIONG Xiong. Study on Optimum of Wire Bonding for the Cooled Infrared Focal Plane Detector[J]. Infrared Technology, 2012, 34(12): 699.
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