光学 精密工程, 2013, 21 (4): 1069, 网络出版: 2013-05-24
符号M阵列结构光的解码
Decoding of structured light based on symbol M-array
解码 三维测量 大尺寸M阵列 单色编码 符号阵列 decoding 3D measurement large size M-array monochromatic encoding symbol array
摘要
在大尺寸M阵列编码模式的基础上, 研究如何对捕获图像进行解码, 进而实现了匹配和三维重构。选择容易识别和区分的矩形块、圆圈和圆盘作为M阵列符号生成投射模式, 对捕获的M阵列编码图像进行解码研究。在充分考虑投射模式、符号特征、投射和捕获环境、符号畸变等因素的影响后, 确定解码方案。在对捕获图像进行预处理的基础上, 采用符号特征识别来确定符号类别, 计算确定矩形块方向, 并以最邻近矩形块方向为基准, 得到圆圈、圆盘方向, 确定各个符号的下邻域和右邻域。遍历所有符号, 获得解码后的M阵列, 利用窗口的唯一性, 确定各个窗口在投射模式中的位置, 进而确定每个匹配点的位置, 生成匹配点坐标矩阵。最后, 利用三角测量法得到深度信息, 实现了物体三维表面重构。
Abstract
On the basis of a previous encoding pattern with a large size M-array, this paper researches how to decode a captured image and then to implement the image matching and image reconstruction. The rectangular block, circle and the disc are chosen as M-array symbols that are easily indentified and distinguished to encode the projecting pattern, then , they are used to study the decoding method for the captured encoding M-array image. By considering projection patterns, symbol features, environments, symbol distortion and other factors fully, the decoding scheme is determined. After preprocessing the captured image, the symbol feature recognition is adopted to recognize the classification of symbols, calculate the directions of angular blocks, and to obtain the directions of circle and disc and determine the nether neighborhood and the right neighbor of symbols by an adjacent angular block as the reference. Furthermore, the decoded M-array is gotten by traversing all symbols. According to the window uniqueness, the position of each window in the projection pattern is determined, then the location of each match point is found and a coordinate matrix of matched points is generated. Finally, the depth information of 3D surface is obtained by using triangulation method and the reconstruction of a 3D surface is finished.
陆军, 李积江, 黄春明. 符号M阵列结构光的解码[J]. 光学 精密工程, 2013, 21(4): 1069. LU Jun, LI Ji-jiang, HUANG Chun-ming. Decoding of structured light based on symbol M-array[J]. Optics and Precision Engineering, 2013, 21(4): 1069.