中国光学, 2013, 6 (2): 201, 网络出版: 2013-05-24
850 nm锥形半导体激光器的温度特性
Temperature characteristics of 850 nm tapered semiconductor lasers
锥形半导体激光器 温度特性 特征温度 tapered semiconductor laser temperature characteristic characteristic temperature
摘要
采用激射波长为850 nm的AlGaInAs/AlGaAs梯度折射率波导分别限制增益量子阱结构的外延片,分别制备了具有锥形结构和条形结构的半导体激光器,并对比分析了两者的温度特性。结果显示,测试温度为20~70 ℃时,锥形结构器件的特征温度为164 K,远高于条形结构器件的96 K;占空比为05%(t=50 μs, f=100 Hz),1 000 mA脉冲电流注入条件下,锥形激光器和条形激光器的波长漂移系数分别为025和028 nm/K;测试温度<50 ℃时,锥形激光器和条形激光器的光谱半高宽分别约为112和124 nm。实验结果表明:相同外延层结构条件下,锥形激光器比条形激光器拥有更高的特征温度。
Abstract
Both tapered structure and broad-stripe semiconductor laser diodes were fabricated based on the AlGaAs/AlGaAs epitaxial layers with a graded-index waveguide separated confinement hetero-structure under the excited wavelength of 850 nm. The temperature characteristics of the devices were investigated and compared at the temperatures between 20 ℃ and 70 ℃. Experiments show that the measured characteristic temperature(164 K) of the tapered devices is much higher than that of the broad devices(96 K) and the wavelength-shift coefficients of the tapered and broad-stripe devices are 025 nm/K and 028 nm/K respectively under a duty cycle of 05%(t=50 μs, f=100 Hz) and a pulsed current of 1 000 mA. When the temperature is below 50 ℃, the Full Width at Half Maximums(FWHMs) of the tapered devices and the broad-stripe devices are 112 and 124 nm, respectively. These results indicate that the tapered lasers have better temperature characteristics than the broad ones with the same epitaxial structure under certain temperature conditions.
黄海华, 刘云, 杨晔, 秦莉, 宁永强, 王立军. 850 nm锥形半导体激光器的温度特性[J]. 中国光学, 2013, 6(2): 201. HUANG Hai-hua, LIU Yun, YANG Ye, QIN Li, NING Yong-qiang, WANG Li-jun. Temperature characteristics of 850 nm tapered semiconductor lasers[J]. Chinese Optics, 2013, 6(2): 201.