提出了一种基于塑料散热器无基板板上芯片(COB)封装方式，采用Ansys有限元热分析软件，与传统的陶瓷基板COB封装方式进行热仿真模拟对比分析。研究表明：将LED芯片直接封装在导热系数为20 W/(m·K)的塑料散热器上的COB封装方式，得到的LED结温明显低于金属基板的COB封装方式的结温，而与陶瓷基板的COB封装方式接近。进一步模拟分析可知，当塑料散热器的厚度为3.9 mm时，器件的总热阻最小，且随着塑料材料的导热系数和塑料散热器表面与空气间对流系数的增加，器件总热阻均有不同程度的减少。由于塑料材料具有容易加工及色泽丰富等优势，这种结构简单的新型封装方式具有广阔的应用前景。

A novel method of LED chip on board (COB) package based on plastic radiator without substrate is proposed. The thermal properties of tradition COB package and this new structure are simulated by using finite element analysis software Ansys. The simulation results show that, by mounting the LED chips on the plastic radiator with thermal conductivity of 20 W/(m·K), the method of LED COB package can provide a much lower temperature than the metal substrate COB package, and is similar to the ceramic substrate COB package. By further simulations, it is found that the thermal resistance is the minimum when the thickness of the plastic radiator is 3.9 mm. Moreover, with the thermal conductivity and the convection coefficient increasing, the thermal resistance reduces in different degrees. Because of the easy preparation process and colorful luster of the plastic, this new method of LED COB package has a broad application prospect.