光学 精密工程, 2013, 21 (7): 1825, 网络出版: 2013-08-05   

工艺参数对平板微小器件注塑翘曲的影响

Effect of processing parameters on warpage of flat micro-mini parts in injection molding
作者单位
1 大连理工大学 微纳米技术及系统辽宁省重点实验室, 辽宁 大连 116085
2 大连理工大学 精密与特种加工教育部重点实验室, 辽宁 大连 116085
摘要
对显著影响平板微小器件注塑成型的翘曲现象进行了研究。为了减少翘曲量, 以带十字微沟槽的微流控芯片的基片为研究对象, 研究了注塑工艺涉及的工艺参数。从注塑残余应力角度分析了翘曲变形的产生机理与演化过程。然后, 以数值仿真和工艺实验为手段, 建立了平板微小器件翘曲的测量方法。设计加工了基于硅型芯的注塑模具, 以翘曲测量方法为基础, 利用正交试验获得了最优注塑工艺参数。最后, 通过极差分析法定量分析工艺参数对翘曲的影响。实验显示, 通过工艺优化获得的最小翘曲量为141 μm, 工艺参数对翘曲的影响由大到小依次为:保压时间、模具温度、保压压力、熔体温度、冷却时间。该研究成果为平板微小器件注塑工艺提供了参考依据。
Abstract
This paper explored the warpage which has significant influence on the quality of inject molding for flat micro-mini parts. To control the warpage to an acceptable level, the warpage of a microfluidics plate with a cross-shaped microchannel was researched and the effect of processing parameters on the warpage was considered in detail. First, the generation mechanism and evolution course of the warpage from injection molding was analyzed based on residual stress. Then, the warpage measurement method was established according to simulation technologies and experimental methods. A Si-core based injection mold was designed and fabricated and the optimum processing parameters were obtained with orthogonal experimental method to achieve the minimum warpage. Finally, the quantitative correlations between the warpage and the processing parameters were investigated by extreme difference analysis. Experimental results indicate that the minimum warpage is 141 μm after optimum processing and the sequence of from strong correlation to weak correlation is:holding time, mold temperature, holding pressure, melting temperature and cooling time. The result is helpful to optimize the injection processing of polymer flat micro-mini parts.

徐征, 王继章, 吕治斌, 刘军山, 王林刚. 工艺参数对平板微小器件注塑翘曲的影响[J]. 光学 精密工程, 2013, 21(7): 1825. XU Zheng, WANG Ji-zhang, Lv Zhi-bin, LIU Jun-shan, WANG Lin-gang. Effect of processing parameters on warpage of flat micro-mini parts in injection molding[J]. Optics and Precision Engineering, 2013, 21(7): 1825.

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