中国激光, 2013, 40 (10): 1002006, 网络出版: 2013-09-25   

一种精确的同轴封装DFB激光器组件的热学模型

Precise Thermal Simulation Module for DFB Laser Sub-Assembly with Transistor Outline Package
作者单位
1 哈尔滨工业大学深圳研究生院, 广东 深圳 518055
2 深圳新飞通光电子技术有限公司, 广东 深圳 518037
摘要
基于有限元方法(FEM)建立了精确的同轴封装无致冷分布反馈布拉格(DFB)激光器发射组件(TOSA)的热分析模型。对TOSA的热场分布和结温进行模拟和分析,并通过实验验证热学模型的正确性。利用极窄脉冲法测量TOSA的峰值波长随壳温的变化,拟合了壳温与波长的定量关系式。通过实测得到激光器的结温、晶体管形(TO)封装管壳的壳温与热功耗的关系曲线,并同时对不同热功耗下的激光器结温和TO封装管壳的壳温进行模拟,FEM模拟的结果与实测结果十分吻合。根据实测的温度梯度求得激光器组件在不同环境温度下的热阻。所建立的热学模型具有较高的精确性,可以用于TOSA及光收发模块的散热设计。
Abstract
A precise thermal simulation model for distributed feedback Bragg (DFB) laser transmitter optical swb-assembly (TOSA) with uncooled transistor outline package is established based on the finite element method (FEM). The thermal gradient and junction temperature are simulated and analyzed. The self-consistency of this model is verified by comparing with experiments. The change of lasing peak wavelength as a function of case temperature is measured by pulse injection and the relationship is calculated. The relationships between laser junction temperature, case temperature of transistor outline (TO) case and thermal power are obtained by measurements. The laser junction temperature and TO case temperature are also simulated at different thermal powers. The simulated results are agree well with the measured results. The thermoresistance of the laser subassembly is calculated based on the measured temperature gradient at different environmental temperatures. The thermal model reported by this paper is very precise and can be used for thermal design of TOSA and transceiver.

侯小珂, 张丽卿, 张胜利, 王雷, 姚勇. 一种精确的同轴封装DFB激光器组件的热学模型[J]. 中国激光, 2013, 40(10): 1002006. Hou Xiaoke, Zhang Liqing, Zhang Shengli, Wang Lei, Yao Yong. Precise Thermal Simulation Module for DFB Laser Sub-Assembly with Transistor Outline Package[J]. Chinese Journal of Lasers, 2013, 40(10): 1002006.

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