为了研究LED模组的散热性能，对其基板的横向和纵向散热性能进行了对比研究。首先建立加快基板横向和纵向散热性能的有限元模型，即在基板上覆盖高导热层和基板内添加高热导率热沉结构。并运用有限元（FEM）分析方法对两种基板的散热效果以及基板和LED芯片温度分布的均匀性进行了对比分析。最后，对于基板上覆盖高导热层的结构，结合实际工艺和散热性能的考虑，进一步优化了高导热层的厚度。

To study the dissipation performance of highpower LED module, the finite element modules were established for studying horizontal and vertical heat dissipation. The modules contain two different substrates: one with high thermal conductivity layer and another with internal high thermal conductivity heat sinks. Heat dissipation effect and the uniformity of the temperature distribution of substrate and LED chips were contrastively analyzed by finite element analysis method. At last, considering practical situations, the thickness of the high thermal conductivity layer was further optimized.