设计了一种基于聚合物材料的延迟线阵列与热光开关的集成器件.利用Rsoft软件设计并模拟了多模干涉热光开关的性能，可实现输出光场强度随电极加热温度变化.设计了螺旋结构的延迟线阵列，利用BPM软件对螺旋结构波导进行数值模拟，综合考虑器件尺寸和损耗参量设计出螺旋结构的弯曲半径.将延迟线阵列结构与热光开关进行集成，能够实现热光控制的聚合物延迟线阵列，该器件可实现的最大延迟时间为399.4 ps，延迟间隔为9.2 ps.以SiO2为下包层，SU-8紫外固化光刻胶为波导芯层，聚甲基丙烯酸甲脂为上包层，采用旋涂、光刻、湿法腐蚀等工艺制备了1×4延迟线阵列与MMI热光开关的集成器件，测试得到了延迟线阵列的近红外输出光斑，插入损耗为15~19 dB.

An integrated device was designed which was composed of thermo-optic switch and delay line array. Rsoft software was used to optimize the parameters of digital multi-mode interference thermo-optic switch, and the varied output signal intensity can be achieved with changing the temperature of an electrode. Then a delay line with a helical structure was designed. Spiral waveguide structure was simulated by BPM software. Considering the size of the device and the loss parameter, a reasonable bend radius of the spiral structure was designed. The integrated delay line array structure with the thermo-optic switch has a maximum delay time of 399.4 ps and the corresponding delay interval is 9.2 ps. The device has three layers, which are fabricated by using SiO2 as lower cladding layer, SU-8 photoresist as core layer and polymethylmethacrylate as upper cladding layer. By spin coating, lithography and wet etching, an integrated device with 1×4 MMI thermo-optic switch and delay line array was fabricated, and near-infrared field patterns of the delay line array was tested with insertion loss of 15~19 dB.