基于蒙特卡罗方法模拟、计算并分析了芯片类型、大小、间距、数量以及布局对GaN 基发光二极管（LED） 集成封装器件COB（Chip On Board）能效的影响。计算结果表明：在芯片间距小于200 μm且芯片尺寸或布局等参数相同的条件下，正装LED COB的能效最低，其次为倒装LED COB，垂直结构芯片的能效最大。当芯片间距大于200 μm，3种LED COB的能效趋向饱和。芯片尺寸增加或数量减少可使正装和倒装芯片COB的能效上升，而垂直结构COB的能效基本保持不变。加入图形衬底可提高同样尺寸或布局的正装芯片COB封装器件的能效，但使倒装芯片COB的能效恶化。分析表明：芯片的侧面出光量占整个芯片出光量的比值以及相邻芯片材料的吸收对3种类型COB封装器件的能效有决定性影响。文中还针对正装芯片COB设计了新型菱形芯片布局，与常规正方形芯片布局的COB相比，其能效提高了6.2%。

On the basis of Monte Carlo simulation, the influence of chip types, sizes, spacing, numbers and layouts on the energy efficiency of a GaNbased Light Emission Diode(LED) integrated packaging COB(Chip On Board) device was analyzed. The calculation results show when the chip spacing is less than 200 μm while the other parameters are fixed, the faceup chip COB LED has the lowest energy efficiency, and that of the flip chip COB LED comes second and the vertical chip COB LED provides the highest energy efficiency. Moreover, each energy efficiency of these three kinds of COB LED devices tends to saturation when the chip spacing is larger than 200 μm. The increase of the chip size or the decrease of the chip amount can improve the energy efficiencies of the faceup COB LED and flip chip COB LED, while the energy efficiency of the vertical chip COB LED keeps almost a constant. The substrate patterning can improve the energy efficiency of faceup chip COB device with the same size or layout， however it deteriorates that of the flip chip COB device. It is concluded that the percentage of the light emitted from the side surface of the chip and the materialabsorption among adjacent chips have a decisive influence on the energy efficiency of the three types of COB packaging devices. As for faceup chip COB LED, a diamondshaped layout of the chips was presented, and the simulation result shows that the energy efficiency can be increased by 6.2% as compared with that of conventional square chip layout.