在电真空器件的制造过程中，不规则零件的镀镍是关键步骤之一。采用阴极移动技术在不规则零件表面沉积了镀镍层。利用X射线荧光仪、激光共聚扫描显微镜、弯曲阴极法研究了阴极移动对镀层沉积率、表面形貌、孔隙率和内应力等的影响。结果表明：当阴极移动速率在1.5 m/min以上时,可以明显降低不规则零件的针孔现象，但无法完全消除；阴极移动不会影响不规则零件的电沉积速率，但会使镀层的结晶颗粒变大，导致零件表面粗糙度增大；阴极移动可以显著地降低镀层的孔隙率和镀层的内应力，但是与移动的速率关系不大。

In fabrication of vacuum electronics device, one of the most important steps is electroplating nickel coating on irregular parts. Ni coatings on the surface of irregular parts were prepared by moving-cathode electroplating technology. The effects of cathode movement on the properties—electrodeposition rate, micro morphology, porosity and inner stress of Ni coating—were investigated by XRF，CLSM， and bending-cathode methods. The results show that cathodic moving speed above 1.5 m/min can significantly reduce the pinholes phenomenon of coating, but not completely. Cathode movement would not affect the electrodeposition rate of the irregular parts, but it would make the crystalline particles of the coatings bigger, thus increase the surface roughness; cathode movement could reduce the porosity and the internal stress of the coatings remarkably but with little relationship to the moving speed.