针对带有常规的第一类反光杯的基板结构因受限于封装引线键合工艺而反光杯尺寸较小的情况, 通过光学理论分析了其存在反射光线不完全的问题, 提出在LED模组芯片间开设第二类反光结构的解决方案。并基于光学分析软件Tracepro的仿真研究, 验证了其有效性。在此基础上设计了新型包含两类反光杯的基板结构, 最高可使LED模组出光效率和中心光强与没有开反光杯的情况相比提升近23%和 38%。

For conventional first-class reflective cups, the substrate structure is subject to the package wire bonding process, so the size of the reflective cups is small. In this paper, the optical methods for analyzing the problem of light reflected incompletely were analyzed with optical theories. The solution of locating second-class reflective cups between the chips of the LED module was proposed. Simulation study based on the optical analysis software Tracepro verified its validity. Then, a new substrate structure containing two types of reflective cups was designed. Tests show that the light extraction efficiency and the central light intensity can be improved by 23% and 38% compared with the substrate structure without reflective cups.