非制冷红外焦平面探测器是热成像系统的核心部件。介绍了非制冷红外焦平面探测器的工作原理及微测辐射热计、读出电路、真空封装三大技术模块，分析了影响其性能的关键参数。与微测辐射热计设计相关的重要参数包括低的热导、高的红外吸收率、合适的热敏材料等；读出电路的传统功能是实现信号的转换读出，近年来也逐渐加入了信号补偿的功能；真空封装技术包括了金属管壳封装、陶瓷管壳封装、晶圆级封装和像元级封装。列举了国内外主要厂商的非制冷红外焦平面探测器的技术指标及近年来的最新技术进展，总结了非制冷红外焦平面探测器的技术发展趋势。

Uncooled infrared FPA is key component of thermal device. The structure and technical theory of uncooled infrared FPA is introduced with analysis of key parameters. Uncooled infrared FPA consists of micro-bolometer, ROIC and vacuum package. Some of the most important micro-bolometer design parameters are a low thermal conductance, a high absorption of the infrared radiation, a bolometer temperature sensing material. ROIC achieve signal conversion and read out, now it can compensate non-uniformity of signal. Vacuum package are include metallic package, ceramic package, wafer level package and pixel level package. Most important manufacturers’ products are introduced in this paper. At last, the technical development trends of uncooled infrared FPA are summarized.