激光器工作时由于存在各种非辐射复合损耗和自由载流子吸收等损耗机制, 使注入到器件中的部分电功率转换成热耗散在激光器内, 直接影响激光器的效率和寿命, 因此散热处理一直是一个引人注意的焦点。采用微通道载体解决大功率半导体激光器阵列连续工作时散热问题, 通过ANSYS软件模拟优化结构参数, 实验测得了大功率半导体激光器阵列热阻。

When the laser diodes working, the losses of various non-radiating recombination and free carrier absorption are inevitable, so portion of the electrical power is converted into heat dissipation, which caused direct impact on the efficiency and lifetime of the laser. So the heat treatment has been a focus of attention. The micro channel heat sink is used to solve the problem of heat dispersing when the high power semiconductor laser array working, the structure parameters of the micro channel heat sink is optimized by using the ANSYS simulation software, and the thermal resistance of the high power semiconductor laser array is tested.