介绍了激光氧化铝陶瓷基板划片的基本原理，由三维固体中的热传导微分公式描述激光与材料的热过程，对激光加工的氧化铝陶瓷基板表面的损伤阈值进行了计算分析。利用相干公司400 W 的E400 射频CO2激光器、IPG 公司YLR-150/1500-QCW-AC 150 W 准连续型光纤激光器搭建了激光加工平台，对1 mm 厚度内的96%氧化铝陶瓷基板进行了切割和划片加工实验。实验中，通过在陶瓷基板表面涂抹吸收剂，利用氮气作为辅助气体，解决了光纤激光器在连续波模式下加工时由于氧化铝陶瓷高反特性出现的切割和划片断点问题。实验表明，当光纤激光器工作在准连续波模式时，实现了无需对陶瓷表面进行涂吸收剂处理，直接用空气作为辅助气体对1 mm 厚度内96%氧化铝陶瓷基板的切割和划片。

Processing of alumina ceramic substrate by laser scribing is introduced, and alumina ceramic surface gasification threshold of laser processing is analyzed based on the three-dimensional heat conduction model. A laser processing experimental platform used for alumina ceramic substrate is built with a Coherent E400 radio frequency CO2 laser and an IPG YLR-150/1500-QCW-AC fiber laser. 96% alumina ceramic substrate with the thickness within 1 mm is used for cutting and scribing experiments. The processing results are compared. During the experiment, in fiber laser continuous wave mode, breaking problems during cutting and scribing are solved by using absorbent on the ceramic surface and nitrogen as auxiliary gas. The experimental results show that 96% alumina ceramic substrate with thickness within 1 mm can be processed by cutting and scribing by using air as auxiliary gas without absorbent and with appropriate technology parameters in the qwasi-continuous wave mode.