硅基光互连技术是解决目前电互连制约瓶颈的有效手段, 而实用化集成光源的制备对硅基芯片功耗的降低和尺寸的减小有着十分重要的意义。硅基集成激光器在过去的十多年间取得了一系列重要突破, 其中III-V/Si混合集成激光器是近期最可能获得实际应用的方案之一。文章简要分析了硅基集成激光器的研究现状, 重点介绍了III-V/Si混合集成激光器的研究进展, 包括III-V/Si键合激光器和III-V/Si倒装焊激光器的发展和各自存在的问题, 并预测了硅基集成激光器的发展方向。

The silicon-based optical interconnect technology is an effective means for breaking the current bottleneck of the electronic interconnects, and the applicable integrated light sources are of great significance to the reduction of size and power consumption of silicon chips. We have seen a series of important breakthroughs in lasers integrated on silicon chips in the past decade or more, and the III-V/Si hybrid integrated laser is one of the most possible solutions among them to be actually applied in the near future. In this paper, we briefly describe its research status, focusing on the research progress and respective problems of the III-V/Si hybrid integrated lasers, including the III-V/Si adhesively bonded laser and the III-V/Si flip-chip laser. Finally, we predict the development orientation of the lasers integrated on silicon.