光电子技术, 2015, 35 (3): 159, 网络出版: 2016-01-19  

基于4-f光学成像系统的光学频谱编码几何超分辨成像

Geometric Superresolution by Using Optical Spectrum Encoding Mask Based on 4-f Optical Imaging System
作者单位
1 中国科学院 光电研究院, 北京 100190
2 中国科学院大学, 北京 100049
摘要
设计了一个4-f光学成像系统, 通过在光学系统成像透镜前加入二维正交光学频谱编码模板这一种新型的成像方式, 来提高成像分辨率切不受CCD像元的限制。改进了基于光学机械工程的编码版理论设计, 同时分析这些可在成像区域造成光学衍射的编码版不同的正交形式。方案中对总尺寸、形式以及编码板的参数进行了计算和讨论, 以确保符合所有波长的指标。另外, 设想了基于零到二级衍射的光谱信息, 可以在经过数学运算之后得到与原始输入对象相匹配的光谱数据。并经过理论研究、修正与算法仿真, 初步的测试系统结果表明编码版可以增加两倍的分辨率来降低同样倍数的视场。
Abstract
The design of a 4-f optical imaging system by developing a novel approach to enhance resolution beyond the limit set by CCD's pixels is introduced and a two-dimensional and orthogonal encoding mask is attached in front of the imaging lens to modulate frequency in input target spectrum .To improve and revise the theoretical design for the encoding mask based on the design limit of optical-mechanical engineering, the different orthogonal forms of encoding masks which can bring the spectra diffraction to the imaging area were analyzed. In this scheme, the total dimension, formation and element dimension of the encoding mask were calculted and discussed to ensure compliance with all the optical wavelengths of project indicator. Furthermore, the spectrum message based on the zero level to the second diffraction was considered and finallythe spectrum data matched to the original input object after mathematical process was achieved.According to the theoretical discussion, revision and algorithm simulation, it is shown by the results in the preliminary testing system that the encoding mask can be used to produce enhancement of resolution by a factor of 2 in exchange for decreasing the field of view by the same factory.

吴戈, 刘扬阳, 吕群波, 李伟艳, 赵娜, 裴琳琳, 张丹丹, 王建威. 基于4-f光学成像系统的光学频谱编码几何超分辨成像[J]. 光电子技术, 2015, 35(3): 159. WU Ge, LIU Yangyang, LV Qunbo, LI Weiyan, ZHAO Na, PEI Linlin, ZHANG Dandan, WANG Jianwei. Geometric Superresolution by Using Optical Spectrum Encoding Mask Based on 4-f Optical Imaging System[J]. Optoelectronic Technology, 2015, 35(3): 159.

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