光学 精密工程, 2016, 24 (1): 39, 网络出版: 2016-03-22   

板上芯片集成封装发光二极管的光色检测系统

Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs
作者单位
1 中国计量学院 光学与电子科技学院, 浙江 杭州 310018
2 浙江理工大学 信息学院, 浙江 杭州 310018
摘要
针对板上芯片(COB)集成封装发光二极管(LED)补粉排测设备对光色参数检测的需求, 研制了一套基于光纤光谱仪的LED快速光色检测系统。该系统包括光色参数检测模块、LED测试机械结构及显示模块等3个部分。光色参数检测模块主要由自制光谱仪构成, 用于对测量获得的光谱数据进行计算, 进而得出LED的光色参数。LED测试机械结构由积分球和可加装不同COB封装LED的夹具测试平台构成。基于该系统架构, 可快速测量LED的光通量、色坐标及色温等参数。利用该设备进行了COB封装LED的快速扫描并测量了它的光色参数, 期间操作者可根据实际测量结果进行相应的补粉。结果表明: 在测试10颗LED时, 单次测量时间少于3 s; LED色坐标准确度优于±0.003, 色坐标重复性小于0.000 5, 色温测试精度为0.6%@5700K, 色温重复性误差小于0.000 8。测试结果满足了当前大功率COB封装LED测试系统对速度、准确性和重复性的要求。
Abstract
According to the demands of Chip-on-board(COB) wafer level packing Light Emitting Diode(LED) powder complement and discharge equipment for the photoelectric parameter measurement, this paper develops a self-designed fast LED photoelectric parameter measurement system based on a fiber optic spectrometer. The system consists of an optical parameter detection module, a mechanical structure of LED measurement and a display module. The optical parameter detection module mainly consists of a homemade spectrometer for acquiring the spectral data to get the chromatic parameters of the LED. The mechanical structure of LED measurement consists of an integrating sphere and a test platform to be mounted different holders of COB packaging LED. It can measure the luminous flux, color coordinates and color temperatures fast. The designed LED photoelectric parameter measurement system is used to scan the COB packaging LED and measure photoelectric parameters, meanwhile the operator can repair powders based on actual measurement results. The results for the measurement of 10 LEDs show that the single measurement time is less than 3 s, the color coordinate accuracy and color coordinate repeatability are better than 0.003 and less than 0.000 5, respectively, and the color temperature precision and color temperature repeatability are 0.6%@5700K and less than 0.000 8, respectively. It satisfies the requirements of measurement system for the high-power COB packaging LED and is characterized by fast speeds, higher accuracy and higher repeatability.

裘燕青, 张刘刘, 陈苗根, 王成群. 板上芯片集成封装发光二极管的光色检测系统[J]. 光学 精密工程, 2016, 24(1): 39. QIU Yan-qing, ZHANG Liu-liu, CHEN Miao-gen, WANG Cheng-qun. Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs[J]. Optics and Precision Engineering, 2016, 24(1): 39.

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