应用激光, 2016, 36 (1): 14, 网络出版: 2016-03-28
软氮化—半导体激光淬火复合强化工艺研究
Diode Laser Hardening of a Soft-nitrided Steel-a Process Research
摘要
针对软氮化层深浅、硬度低、承载能力差的问题, 采用半导体激光对30CrNiMo软氮化层表面进行激光淬火复合强化工艺研究。研究了激光功率与扫描速度对复合强化的层深、金相组织和显微硬度的影响规律。软氮化层的硬度及硬化层深明显增加, 且表面硬度和层深可由激光工艺参数来调整。当激光功率为1 100 W, 扫描速度为600 mm/min时, 复合强化工艺与软氮化处理相比表层硬度可提高300 HV左右, 硬化层深可完全覆盖软氮化层深。
Abstract
Diode laser hardening was carried out on a soft-nitrided steel (30CrNiMo) to solve some problems such as shallow layer, low hardness and poor loading capacity. The influence of laser power and scanning speed on hardened depth, microstructure and microhardness was investigated. Results show that the microhardness and hardened depth were increased significantly, the microhardness value and hardened depth could be adjusted by laser parameters. At 1 100 W laser power and 600mm/min scanning speed,the microhardnessof hardened layer was improved about 300 HV compared with the as-nitridedstate, and the hardened depth could completely cover the original layer.
熊大辉, 朱金凯, 叶兵, 莫衡阳, 王爱华. 软氮化—半导体激光淬火复合强化工艺研究[J]. 应用激光, 2016, 36(1): 14. Xiong Dahui, Zhu Jinkai, Ye Bing, Mo Hengyang, Wang Aihua. Diode Laser Hardening of a Soft-nitrided Steel-a Process Research[J]. APPLIED LASER, 2016, 36(1): 14.