利用波长355 nm的纳秒激光和1064 nm的皮秒激光对蓝宝石基片进行刻槽及切割实验，通过控制变量法研究了微槽深度、宽度及质量随工艺参数变化的情况，并进行对比分析。结果表明，355 nm纳秒激光加工过程存在很大的热作用，而且刻蚀效率低，即使其峰值功率密度达到109 W/cm2也不能实现对蓝宝石毛坯片的图形切割；而1064 nm皮秒红外激光切割微槽的质量很高，几乎可实现完全的“冷加工”。最后，通过分析总结，认为激光峰值功率密度达到1012 W/cm2可实现对蓝宝石基片的图形切割，且利用平均功率1 W、单脉冲能量1 mJ、脉宽15 ps的1064 nm红外激光，实现了0.55 mm厚蓝宝石毛坯基片的高质量图形切割。

The experimental research regarding grooving and cutting the sapphire substrate by nanosecond laser with wavelength of 355 nm and picosecond laser with wavelength of 1064 nm is presented. The influence of adjusted processing parameters on the depth, width and quality of grooves via controlling the variable method is studied. Furthermore, the comparative analysis shows that the thermal effect of 355 nm nanosecond laser processing is very big, and the etching efficiency is low, which cannot achieve graphs cutting of sapphire substrate even if its peak power density reaches 109 W/cm2. However, 1064 nm picosecond infrared laser cutting quality of micro groove is very high, which can realize completely “cold” processing. Eventually, the results show that the graphs cutting on sapphire substrate can be realized with the laser peak power density of 1012 W/cm2, The high-quality graphs cutting on the blank of sapphire substrate with 0.55 mm thickness is realized by 1064 nm infrared laser with average power 1 W, single pulse energy 1 mJ, and pulse width 15 ps.