在TCAD半导体仿真环境中, 建立了0.25 μm栅长的AlGaAs/InGaAs高电子迁移率晶体管(HEMT)低噪声放大器与微波脉冲作用的仿真模型, 基于器件内部的电场强度、电流密度和温度分布的变化, 研究了1 GHz的微波从栅极和漏极注入的损伤机理。研究结果表明, 从栅极注入约40.1 dBm的微波时, HEMT内部峰值温度随着时间的变化振荡上升, 最终使得器件失效, 栅下靠源侧电流通道和强电场的同时存在使得该位置最容易损伤; 从漏极注入微波时, 注入功率的高低会使器件内部出现不同的响应过程, 注入功率存在一个临界值, 高于该值, 器件有可能在第一个周期内损伤, 损伤位置均在漏极附近。在1 GHz的微波作用下, 漏极注入比栅极注入更难损伤。

The device model of AlGaAs/InGaAs high electron mobility transistor(HEMT) low noise amplifier with 0.25 μm gate length is established using semiconductor simulation tool and the damage mechanism of 1 GHz microwave injected from gate and drain on HEMT is studied based on variety of electric field, current density and lattice temperature in device. Simulated results show that when microwave with 40.1 dBm power level is injected from gate, the peak temperature of HEMT will rise with oscillation and achieve the failure level finally. The location beneath the gate close to source is most susceptible to be damaged due to the effect of high current density path and strong electric field. The device responds with different processes when microwave signal with different power level is injected from drain electrode. HEMT would be damaged in the first cycle if the injected power is higher than the threshold. The position near drain electrode is most susceptible to be damaged. Compared with gate injection, it’s more difficult to damage the device when 1 GHz microwave is injected from drain.