为了研究荧光粉发热对大功率LED器件热特性的影响, 设计了五种不同荧光粉涂敷方式的大功率LED器件, 利用ANSYS软件建立热力学模型进行仿真。将模拟与实测结果进行比较, 结果表明, 铝基板底部的实测温度、透镜顶部的实测温度、芯片的计算结温与加荧光粉热载荷的模拟温度更相近, 不加荧光粉热载荷条件下的模拟温度要低于加荧光粉热载荷的模拟温度和实测温度, 并且荧光粉涂敷的量以及涂敷的方式对芯片结温、铝基板底部温度、透镜顶部温度都有影响。

Five different phosphor coatings of high power LED device are designed to study the thermal characteristics affected by heat phosphor generated for high power LED device. ANSYS software is used to establish thermodynamic model and make simulation. By comparing simulated temperature and measured temperature, results shows that measured temperature which located at the bottom of aluminum substrate, top of lens and calculated junction temperature of the chip for the high power LED device are more close to the simulated temperature of thermal load with phosphor. Meanwhile, simulated temperature of thermal load without phosphor is lower than measured temperature and simulated temperature of thermal load with phosphor. The quantity and the method of phosphor coating can affect the temperature of junction, the bottom of aluminum substrate and the top of lens.