利用倒装芯片制备LED灯丝, 并对其光学、热学的均匀性进行测试分析。采用BM-7瞄点式亮度计和Fluke Ti32成像热仪, 分别对灯丝亮度、色温和表面温度进行测试。实验测得灯丝正面的亮度与色温均高于反面, 测得灯丝反面的温度大于正面。灯丝亮度与表面温度均呈现朗伯分布。通过TracePro光学软件和FloEFD热学软件对LED倒装芯片灯丝分别进行光学和热学模拟, 模拟得到的光照度与温度分布与测试结果相同。灯丝光照度和温度均呈现中间高两端低的分布情况, 两端亮度约为中间的74.4%, 灯丝两端与中间的最大温差为12.4 ℃ , 说明倒装灯丝具有良好的光学均匀性和散热性能, 作为一种新型LED光源灯是可行的。

Flip-chip LED filament was fabricated, whose optical uniformity and thermal uniformity were measured and analyzed. The BM-7 aiming point luminance meter and Ti32 Fluke thermal imagｉｎｇ meter were employed to measure the brightness, color temperature and skin temperature of LED filaments, respectively. The measurement results show that the brightness and color temperature of the positive side is higher than the opposite side of the filament. The skin temperature measurement results show that the opposite side is higher than the positive side. The results show that the brightness and skin temperature of filament are in accordance with Lambert distribution. The optical and thermal parameters of flip-chip LED filaments were simulated by TracePro and FloEFD, respctively. The simulated results show that the illuminance and temperature are distributed with high level in the middle and low level at both ends, which are in agreement with the measured results. The brightness of both ends of filament is about 74.4% against the brightness of center, the maximum difference of temperature between the middle part and both ends is 12.4 ℃. Flip-chip LED filament ｉs verified to have good optical uniformity and thermal properties, and be feasible as a new LED light source.