提出了一种利用氧化钛薄膜对金属铜薄膜表面等离子体共振特性调制的想法。 实验中首先使用电子束蒸发制备一批同等厚度的氧化钛薄膜, 再利用磁控溅射方法在氧化钛薄膜上沉积厚度为5～80 nm不等的金属铜薄膜。 测试结果表明, 氧化钛膜层对不同厚度的金属铜薄膜表面等离子体共振增强具有不同调制效果, 金属铜薄膜厚度小于20 nm时, 底层的氧化钛薄膜对Cu薄膜表面等离子体共振增强效果显著, 且随着金属Cu膜层厚度增加表面等离子体共振峰发生蓝移, 而当金属铜膜层的厚度超过20 nm时, 共振增强效果因金属Cu薄膜消光能力的上升而开始减弱。

In this paper, we propose the surface plasmon resonance intensity modulation of the metal copper deposited on a titanium oxide thin film. Surface plasmon resonance (SPR) has a broad application prospect in various types of detectors and sensors. We first used the electron beam evaporation to obtain TiO2 thin films with the same thickness, and then we prepared copper film with the thickness ranging from 5 to 80 nm with magnetron sputtering method. The results show that the TiO2 film with different thickness copper thin films own different surface plasmon resonance modulation capability. The thinner copper film shows more obvious regulation. When the copper layer thickness is more than 20 nm, the resonance enhancement effect began to weaken because of better extinction capability.