本文对影响LTPS工艺中光刻胶和衬底间粘附力的4个因素进行了实验及理论分析。经实验发现: 衬底的材质和粗糙度以及光刻胶中分子量的分布是影响光刻胶和衬底粘附力的最重要的两个因素。在改善粘附力方面HMDS对于电负性较强的金属衬底和光刻胶的粘附力有较好的改善效果, 对于SiNX、A-Si及P-Si衬底改善效果明显, 且无差异, 对于ITO没有改善。光刻胶涂布后适当延长烘烤时间也可以有效改善光刻胶和衬底的粘附力。

In this paper, four factors have been experimented and analyzed theoretically, which will influence the adhesion between photoresist and the substrate in LTPS process. It is found that the substrate material and roughness and the molecular weight distribution in the photoresist are the two most important factors that affect the adhesion between photoresist and the substrate. In terms of improving adhesion, HMDS makes better performance in improving the adhesion between strong electronegativity metal substrate and photoresist, while has obvious improvement effect in SiNX , A-Si and P-Si substrate, and without any difference among them. But there is no improvement in ITO. Properly extending the baking time can also effectively improve the adhesion between photoresist and the substrate after the photoresist has been coated.