In order to improve laser damage resistance of the Final Optics Assembly (FOA), simulation analysis have been done for 1ω, 2ω and 3ω laser beam considering ghost images to the 4th order. The panels of ground glass scatter ghost laser around the FOA walls and the panels of architectural glass absorb the 1th order energy. The appearance of smoothing fused silica surface defect and the effect of wiping off etching contamination are researched on HF-based etching processes under ultrasonic. Now, 18 shots were executed using 310×310mm laser with 3ns pulse width. During the experiment, the third harmonic laser terminal output energy is 1500J~3500J, and the maximum laser energy flux is about 4J/cm2. This presentation addresses the optical configuration of the FOA, the simulation analysis of ghost, the way of ground glasses absorbing energy and the result of laser damage resistance of fused silica on HF-based etching processes under ultrasonic.