光电子技术, 2017, 37 (2): 139, 网络出版: 2017-12-25
柔性OLED薄膜封装技术分析
Analysis of Thin Film Encapsulation Technology of Flexible OLED
摘要
介绍了当前柔性OLED薄膜封装技术的发展现状;对比了Barix封装、ALD(原子沉积)技术以及喷墨打印在柔性OLED封装领域成本、阻水氧性能以及产能等方面的优劣势,重点分析了离子束同步混合工艺技术在柔性OLED封装领域的应用前景。
Abstract
A comprehensive survey of recent advances on thin film encapsulation technology for flexible OLED was provided. Comparisons were made on the latest technologies to highlight their advantages as well as drawbacks. Particularly, the methods of Barix multilayer deposition, ALD (atomic layer deposition), and ink-jet were critically reviewed with respect to criteria of water and oxygen resistance, capacity, efficiency, and cost. And the application prospect of ion beam synchronous hybrid process technology in flexible OLED encapsulation field was analyzed.
刘阳, 张彬祥, 黄楚佳. 柔性OLED薄膜封装技术分析[J]. 光电子技术, 2017, 37(2): 139. LIU Yang, ZHANG Binxiang, HUANG Chujia. Analysis of Thin Film Encapsulation Technology of Flexible OLED[J]. Optoelectronic Technology, 2017, 37(2): 139.