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骨科数字化3D打印技术及应用

3D Printing Technology in Orthopedics and Its Application

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摘要

综述了近年来3D打印在骨科中的应用和研究的几个层次:3D打印出用于术前模拟手术的模型, 可以形象直观地制定手术方案, 省去手术中多余的步骤, 减少手术时间和风险, 减轻医生的劳动强度;3D打印出基于计算机辅助设计、实现精准化手术的医疗导板和量身定做的植入物, 利用医疗导板可保证手术位置、方向及角度的准确性, 并提高手术的安全性和可预见性;个性化3D打印植入物能更好地满足患者的需要, 但在进入临床前仍面临政策上的挑战。与国外技术相比较, 我国在骨科3D打印方面还存在一定差距, 通过分析指明了我国需要着重发展的技术和对策。最后, 对3D打印在骨科上的应用进行了展望。

Abstract

The recent application of 3D printing technology in orthopedic field is summarized. We explore the applied levels in orthopedics health of 3D printing, the first level is that 3D printing makes out models for preoperative simulation, which eliminates the need for intra-operative steps, reduces the time of surgery, meets the requirements of patients, and reduces the labor intensity of doctors. The next one is that 3D printing produces surgical guide based on computer-aided design to achieve the precision of the tailor-made implant operation, which shows how to use the guide to ensure the accuracy of surgical position, direction and angle, and improve the safety and predictability of surgery. The third one is 3D printed implants encounter the clinical policy challenge, but personalized 3D printed implants can better meet the needs of the patient. Compared with foreign technology, there is still a gap in the 3D printing in the orthopedics in China, which reveals the countermeasures need to be focused on by China. Finally, the future of applications of 3D printing in orthopedics is prospected.

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中图分类号:R641

DOI:10.3788/lop55.011412

所属栏目:“激光增材制造技术”专题

收稿日期:2017-08-03

修改稿日期:2017-10-18

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陈继民:北京工业大学北京市数字化医疗3D打印工程技术研究中心, 北京 100124
张成宇:北京工业大学北京市数字化医疗3D打印工程技术研究中心, 北京 100124
曾勇:北京工业大学北京市数字化医疗3D打印工程技术研究中心, 北京 100124
徐仰立:北京工业大学北京市数字化医疗3D打印工程技术研究中心, 北京 100124

联系人作者:陈继民(Jimin@bjut.edu.cn)

备注:陈继民(1965-), 男, 教授, 博士生导师, 主要从事增材制造、3D打印技术方面的研究。E-mail: Jimin@bjut.edu.cn

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引用该论文

Chen Jimin,Zhang Chengyu,Zeng Yong,Xu Yangli. 3D Printing Technology in Orthopedics and Its Application[J]. Laser & Optoelectronics Progress, 2018, 55(1): 011412

陈继民,张成宇,曾勇,徐仰立. 骨科数字化3D打印技术及应用[J]. 激光与光电子学进展, 2018, 55(1): 011412

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