建立了亚表面损伤深度与抛光参数的关系模型, 探究集群磁流变抛光后单晶蓝宝石亚表面损伤深度与集群磁流变抛光参数的关系, 研究了抛光参数对亚表面损伤深度的影响规律, 运用正交实验验证了模型的合理性.实验中使用白光干涉仪作为测量工具, α-Al2O3抛光液作为抛光液, 每个实验因素选择三个水平, 结果表明：集群磁流变抛光中, 单晶蓝宝石亚表面损伤深度与磨粒粒径和抛光压力有关, 亚表面损伤深度随着抛光压力和磨粒粒径的增大而增大, 抛光压力对亚表面损伤深度的影响远大于磨粒粒径.当抛光压力和磨粒粒径分别为25 kg和280 nm时, 经过100 min抛光, 亚表面损伤深度最小值达到0.9 nm.在集群磁流变抛光中抛光压力是影响亚表面损伤深度的主要因素, 当抛光压力为25 kg时, 集群磁流变抛光可快速去除亚表面损伤.

In order to explore the relationship between single crystal sapphire subsurface damage depth and polishing parameters of cluster magnetorheological finishing, a relationship model of the subsurface damage depth and the polishing parameters was established. The influence of the polishing parameters on the subsurface damage depth was studied, the relation model was verified by orthogonal experiments. White light interferometer was used as the measuring tool, α-Al2O3 was used as the polishing liquid, and three levels were selected for each experimental factor in the experiment. The experimental results show that the subsurface damage depth is related to abrasives size and polishing pressure, the subsurface damage depth increases with the increase of the polishing pressure and the abrasives size .The effect of the polishing pressure on the subsurface damage depth is much greater than that of the abrasives size. When the polishing pressure and the abrasives size are 25 kg and 280 nm, the minimum subsurface damage depth reach 0.9 nm after 100 minutes polishing, the polishing pressure is the main factor affecting the subsurface damage depth in cluster magnetorheological finishing. Under the current experimental conditions, the subsurface damage can be quickly removed when the polishing pressure is 25 kg.