为了实现普通硅酸盐玻璃表面的金属化,利用波长为355nm的脉冲紫外激光刻蚀粗化活化,并结合化学镀,在其表面局域制备出了导电金属铜层。研究了激光加工参量对玻璃表面微观形貌、粗糙度、刻蚀深度的影响规律,并在玻璃表面成功引入了钯元素。结果表明,当第1次紫外激光扫描速率为200mm/s、脉冲频率为100kHz、能量密度为27J/cm2~37J/cm2和填充间距在10μm左右时,玻璃表面可以获得的刻蚀深度在25μm~35μm之间,刻蚀区域的粗糙度Ra在6μm~7μm之间,此时玻璃不会开裂; 而第2次激光的能量密度在9J/cm2~11J/cm2之间时（其余参量不变）,钯元素的引入实现了化学镀铜,此时铜层和玻璃之间的平均结合强度可以达到10MPa以上,铜层的体积电阻率可以达到10-6Ω·cm数量级。这是一种具有局域选择性、无需掩模、低成本、高结合强度和良好导电性的玻璃表面金属化工艺。

In order to realize the metallization of ordinary silicate glass surface, roughness and activation were carried out by pulse ultraviolet （355nm wavelength） laser etching. The conductive copper layer was locally fabricated on the surface with the combination of chemical plating. The influence of laser processing parameters on micro topography, roughness and etching depth of glass surface was investigated. Palladium was successfully introduced into glass surface. The results show that, at the first scanning (UV laser scanning rate of 200mm/s, pulse frequency of 100kHz, energy density of 27J/cm2~37J/cm2 and filling interval of about 10μm), the etched depth of glass surface is between 25μm~35μm and roughness Ra of the etching region is between 6μm~7μm. Glass won’t crack at this time. At the second scanning (energy density between 9J/cm2~11J/cm2 and the remaining unchanged parameters), chemical copper plating was realized by the introduction of palladium. At this point, the average bonding strength between copper layer and glass can be above 10MPa and volume resistivity of copper layer can reach 10-6Ω·cm orders of magnitude. The glass surface metallization process is with local selectivity, no needed mask, low cost, high bonding strength and good electrical conductivity.