应用激光, 2018, 38 (1): 81, 网络出版: 2018-05-03   

飞秒激光扫描刻蚀覆铜板工艺及质量研究

Study on Technology and Quality of Etching Copper Clad Laminate with Femtosecond Laser
作者单位
苏州大学机电工程学院, 江苏 苏州 215021
摘要
为了实现线路板的短流程制作, 采用飞秒激光对覆铜板进行刻蚀实验, 探索不同飞秒激光工艺参量(平均功率、扫描速度、扫描次数、离焦量)对刻蚀深度和底面粗糙度的影响。应用扫描电子显微镜、三维轮廓仪和能谱仪等检测技术对覆铜板刻蚀质量进行检测。结果表明: 由于正离焦的散焦光束和负离焦的聚焦光束的传播特征不同, 使得在同样离焦量的情况下, 负离焦作用到烧蚀面的激光能量更加集中, 加工深度更深。采用优化的激光参数, 可以在铜厚规格约为18 μm的覆铜板上刻蚀出深度为17.76 μm, 粗糙度为0.52 μm的良好窗口, 实现表层铜完全刻蚀, 并保证环氧树脂基底的完整性。
Abstract
In order to shorten the manufacturing process of printed circuit board, femtosecond laser is applied to etch the copper clad laminate, the effect of femtosecond laser processing parameters (average power, scanning speed, scanning times and defocusing amount)on the etching depth and the bottom surface roughness are researched. Scanning electron microscopy, 3D profilometer and energy dispersive spectrometer and other detection techniques are adopted to detect the etching quality of copper etching. The results show that under the circumstance of same defocusing amount, the situation of negative defocus can obtain more energy and etch deeper compared with the situation of positive ones, which is because the different propagation feature between defocusing beam in positive state and focusing beam in negative state. With optimized laser parameters, the femtosecond laser can etch the copper layer entirely and keep epoxy resin board intact, the good window etching depth is 17.76 μm and roughness is 0.52 μm on a copper clad laminate with a copper thickness of about 18 μm.

施克明, 王明娣, 陈添禹, 刘凯, 陈磊. 飞秒激光扫描刻蚀覆铜板工艺及质量研究[J]. 应用激光, 2018, 38(1): 81. Shi Keming, Wang Mingdi, Chen Tianyu, Liu Kai, Chen Lei. Study on Technology and Quality of Etching Copper Clad Laminate with Femtosecond Laser[J]. APPLIED LASER, 2018, 38(1): 81.

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