为了探究发光二极管(LED)封装胶对LED失效性的影响, 选取LED封装硅胶失效案例进行了失效性分析.利用傅里叶转换红外光谱分析和气相色谱质谱联用仪对失效样品进行成分分析, 根据分析结果总结样品的失效机理.分析结果表明: LED灯珠封装气密性检测过程中材料的化学不兼容性导致封装胶失效, LED灯珠气密性变差, 进而影响到光、电、热、机械结构、材料特性等, LED可靠性降低.在LED生产制造过程中, 需要避免材料的不兼容性, 增加LED的可靠性.

In order to explore the impact of Light Emitting Diode (LED) silicone package on the LED failure, the failure case of LED packaging glue is chosed to analyze the failure. Fourier transform infrared spectroscopy and gas chromatography mass spectrometry were used to analyze the composition of the failed samples. Finally, the failure mechanism of the samples was obtained based on the analysis results. The analysis results show that, the chemical incompatibility of the material in the LED lamp bead package sealing process leads to the failure of the sealing glue, and the LED lamp beads have a poor air tightness, which affects the light, electricity, heat, mechanical structure, and material properties. LED reliability is reduced; therefore, in the manufacturing process of LED, it is also necessary to avoid material incompatibility and increase the reliability of the LED.