目前, 决定非制冷红外焦平面探测器成本和可靠性的主要因素之一是其真空封装技术水平。本文主要介绍了非制冷红外探测器封装技术的发展现状, 详细说明了典型金属封装、陶瓷封装、晶圆级封装及像元级封装的基本结构和组装工艺, 并指出了其优缺点和未来发展趋势。

At present, one of the main factors determining the cost and reliability of uncooled IRFPA detectors is the level of vacuum packaging technique. The development status of packaging techniques of uncooled IRFPAs is reviewed in this paper. The basic structure and assembly processes of typical packaging techniques including metal packaging, ceramic packaging, wafer level packaging, and pixel level packaging are described in detail. Their characteristics and the development trends for the future are also described.